MEMS disc drive

ABSTRACT

A micro-electromechanical systems (MEMS) disc drive includes high-precision and integrated components to allow for increased functionality, robustness and reduced size as compared to currently produced disc drives. Integrating multiple subcomponents of the disc drive using batch processing provides low manufacturing costs. Furthermore, using MEMS techniques, new features can be added to disc drives. For example, an environmental control component, an accelerometer and/or a thermometer may be integrated into the housing of the disc drive.

TECHNICAL FIELD

The invention relates to disc drives.

BACKGROUND

A disc drive typically includes a base to which various drive componentsare mounted. A cover connects with the base to form a housing thatdefines an internal, sealed environment. The components include aspindle motor, which rotates one or more discs at a constant high speed.Information is written to and read from tracks on the discs through theuse of an actuator assembly. The actuator assembly includes one or moreactuator arms, which extend towards the discs. Mounted on each of theactuator arms is a head, which includes one or more transducer elementsto perform read operations, write operations or read and writeoperations. Heads generally include an air bearing slider enabling thehead to fly in close proximity above the corresponding media surface ofthe associated disc. An air bearing slider does not necessarily need airto operate. For example, in some designs, the internal environment of adisc drive may be filled with a fluid other than air, e.g., helium.

Increases in storage media density have allowed disc drive manufacturesto produce disc drives with large capacities, but which are much smallerthan disc drives generally found in desktop computers. For example, afive gigabyte disc drive having a smaller profile than a credit card,and a thickness less than a quarter-inch is currently available. Smalldisc drives are scaled versions of what has been developed for largerversions.

However, smaller disc drive designs create new challenges. Current discdrive designs have begun to reach the limits of conventionalmanufacturing techniques. Smaller disc drives developed for consumerelectronics, e.g., cell phones and PDAs, must withstand higher shocksthan desktop or laptop computer disc drives. Manufacturing tolerances ofthe mechanical components of a disc drive are relatively crude in smallform factor drives. For this reason, physical stops, e.g., gimballimiters, used in conventional disc drives to prevent the actuatorassembly from contacting the media surface are only effective for largedisplacement shocks. In another example, the minimum thickness of a discdrive can be limited because suitable rotary bearings for the actuatorassembly become difficult to manufacture for disc drive design with asmall height, e.g., a height of less than 3.5 millimeters (0.14 inches).Also, manufacturing tolerances for disc drive designs force the gapbetween the permanent magnet and the voice coil of the actuator assemblyto be at least about 25 micrometers. A smaller gap would be preferred toprovide greater force, require less energy to move the actuatorassembly, and/or use a smaller actuation mechanism, which generallyincludes a permanent magnet and voice coil. These and other challengesmust be met to develop even smaller disc drive designs.

In a separate development, micro-electromechanical systems (MEMS)microstructures are manufactured in batch methodologies similar tocomputer microchips. The photolithographic techniques that mass-producemillions of complex microchips can also be used simultaneously todevelop and produce mechanical sensors and actuators integrated withelectronic circuitry. Most MEMS devices are built on wafers of silicon,but other substrates may also be used. MEMS manufacturing processesadopt micromachining technologies from integrated circuit (IC)manufacturing and batch fabrication techniques.

Like ICs, the structures are developed in thin films of materials. Theprocesses are based on depositing thin films of metal, insulatingmaterial, semiconducting material or crystalline material on asubstrate, applying patterned masks by photolithographic imaging, andthen etching the films to the mask. In addition to standard ICfabrication methods, in MEMS manufacturing a sacrificial layer isintroduced—a material which keeps other layers separated as thestructure is being built up but is dissolved in the very last stepleaving selective parts of the structure free to move.

Use of established “batch” processing of MEMS devices, similar to volumeIC manufacturing processes, eliminates many of the cost barriers thatinhibit large scale production using other less proven technologies.Although MEMS fabrication may consist of a multi-step process, thesimultaneous manufacture of large numbers of these devices on a singlewafer can greatly reduce the overall per unit cost.

Surface micromachining, bulk micromachining and electroforming(lithography, plating and molding) constitute three general approachesto MEMS manufacturing. Surface micromachining is a process based on thebuilding up of material layers that are selectively preserved or removedby continued processing. The bulk of the substrate remains untouched Incontrast, in bulk micromachining, large portions of the substrate areremoved to form the desired structure out of the substrate itself.Structures with greater heights may be formed because thicker substratescan be used for bulk micromachining as compared to surfacemicromachining.

Electroforming processes combine IC lithography, electroplating andmolding to obtain depth. Patterns are created on a substrate and thenelectroplated to create three-dimensional molds. These molds can be usedas the final product, or various materials can be injected into them.This process has two advantages. Materials other than the wafermaterial, generally silicon, can be used (e.g. metal, plastic, ceramic)and devices with very high aspect ratios can be built. Electroformingcan also be a cost-effective method of manufacturing due to, e.g.,relatively inexpensive processing equipment.

Another fabrication technique is wafer bonding. Wafer bonding can beused to bond micromachined silicon wafers together, or to othersubstrates, to form larger more complex devices. Examples of waferbonding include anodic bonding, metal eutectic bonding and directsilicon bonding. Other bonding methods include using an adhesive layer,such as a glass, or photoresist.

MEMS fabrication processes usually include deposition, etching andlithography. These processes are repeated in according to an orderedsequence to produce the layers and features necessary for the MEMSstructure. Deposition refers to the deposit of thin films of materialand includes depositions from chemical reactions and depositions fromphysical reaction. Depositions from chemical reactions include chemicalvapor deposition, electrodeposition, epitaxy, and thermal oxidation.These processes use solid material created directly from a chemicalreaction in gas/or liquid compositions or with the substrate material.Generally, the chemical reaction will also produce one or morebyproducts, which may be gases, liquids and even other solids.Depositions from physical reactions include physical vapor deposition(e.g., evaporation or sputtering) and casting. In depositions fromphysical reactions a deposited material is physically placed on thesubstrate without creating a chemical byproduct.

Etching is a process of removing portions of deposited films or thesubstrate itself. Two types of etching processes are wet etching and dryetching. Wet etching dissolves the material by immersing it in achemical solution. Dry etching occurs by dissolving the material usingreactive ions or a vapor phase etchant.

Lithography in the MEMS context is typically the transfer of a patternto a photosensitive material by selective exposure to a radiation sourcesuch as light. When a photosensitive material is selectively exposed toradiation, e.g. by masking some of the radiation, the radiation patternon the material is transferred to the material exposed. In this manner,the properties of the exposed and unexposed regions differ.

Deposition, etching and lithography processes may occur in combinationrepeatedly in order to produce a single MEMS structure. Lithography maybe used to mask portions of a film or the substrate. Masked portions maybe protected during a subsequent etching process to produce precise MEMSstructures. Conversely, masked portions may themselves be etched. Thisprocess can be used to make a component or a mold for a component. Forexample, multiple layers of film can be deposited onto a substrate.Following each deposition step, a lithography step may be preformed todefine a desired cross section of a MEMS structure through that layer.After a desired number of layers have been deposited and individuallysubjected to radiation patterns in lithography steps, portions of thelayers defining the MEMS structure can be removed with a single etchingprocess, leaving a mold behind for the desired MEMS structure. Acompatible material may then be injected into the mold to produce thedesired MEMS structure. As shown by this example, precise and complexstructures may be produced using MEMS techniques.

SUMMARY

In general, the invention is directed to disc drives that may bemanufactured using MEMS techniques. According to one aspect of theinvention, integrated components of a disc drive are manufactured usingMEMS processes. For example, a complete disc drive may requireprocessing one or more wafers. For example, one wafer may include abase, disc and actuator and another wafer may include a cover having anintegrated environmental control component and integrated permanentmagnet. In this example, after the two wafers are separately processed,the cover is bonded and sealed to the base to complete the disc drivemanufacturing process. Furthermore, a wafer may contain integratedcomponents for multiple disc drives. Including components for multipledisc drives on a single wafer provides reduced costs. In one embodiment,the invention is directed to a device comprising a housing, a rotatablemedia disc and an actuator including a head to communicate with therotatable media disc. The housing, the rotatable media disc, the headand the actuator are manufactured from a single wafer substrate.

In a different embodiment, the invention is directed to a devicecomprising a housing including a base and a cover, a MEMS rotatablemedia disc, and a MEMS actuator including a head to communicate with therotatable media disc. The MEMS actuator is bonded to the base or thecover.

In another embodiment, a device comprises a rotatable media disc, and ahousing including a base. The rotatable media disc and the base form anintegrated disc motor to rotate the rotatable media disc. The base andthe rotatable media disc are manufactured as a single component from asingle wafer substrate.

Embodiments of the invention may provide one or more of the followingadvantages. For example, MEMS techniques allow integrated circuits to beintegrated with structural components of a HDD. Furthermore, MEMStechniques may provide significantly reduced design tolerancerequirements compared to disc drive designs using convention techniques.Furthermore, batch fabrication techniques similar to those used forintegrated circuits applied to disc drives can reduce manufacturingcosts, allow for complex integrated component designs and reduce requiredesign tolerances as compared to conventional disc drive manufacturingtechniques.

The details of one or more embodiments of the invention are set forth inthe accompanying drawings and the description below. Other features,objects, and advantages of the invention will be apparent from thedescription and drawings, and from the claims.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A-C illustrate a disc dive manufactured using MEMS techniques.

FIG. 2 is a cut-away illustration of a disc dive manufactured using MEMStechniques.

FIG. 3 shows an exploded view of an integrated recordable disc andmotor.

FIG. 4 is a close-up view of an integrated recordable disc and motor.

FIG. 5 illustrates an electromagnetic induction actuation mechanism fora recordable disc.

FIG. 6 illustrates an electrostatic actuation mechanism for a recordabledisc capable of capacitive disc sensing.

FIG. 7 illustrates an electromagnetic actuation mechanism for arecordable disc.

FIGS. 8A-C are cross-section illustrations showing a disc dive includingactuator electrodes integrated with the base of the disc drive.

FIG. 9 illustrates a recordable disc centered on a hub including fluidbearings.

FIG. 10 illustrates a recordable disc constrained by ring of fluidbearings at the outer diameter of the recordable disc.

FIG. 11 illustrates a recordable disc centered on a hub includingcentering fingers with fluid bearings.

FIG. 12 illustrates a recordable disc constrained by ring of centeringfingers with fluid bearings at the outer diameter of the recordabledisc.

FIGS. 13A-B illustrate a side view of a recordable compliant discmounted on a center hub.

FIG. 14 shows a recordable disc mounted on a center hub designed toprovide radial and axial thrust bearing support.

FIG. 15A illustrates a recordable disc and disc drive housing includinga multi-level support bearing with textured fluid bearing surfacesbetween the disc and disc drive housing.

FIG. 15B illustrates a single-level recordable disc and disc drivehousing with textured fluid bearing surfaces between the disc and discdrive housing.

FIG. 16 illustrates an electromagnetically levitating rotary bearing andexemplary micromachine process steps for its manufacture.

FIG. 17 illustrates an annular chuck mechanism with an adjustableinternal diameter.

FIG. 18 illustrates a recordable disc and adjustable outer diameterfluid bearing.

FIGS. 19A-C illustrate exemplary process steps to produce a MEMS discdrive having a center hub to constrain the disc as it rotates.

FIGS. 20A-C illustrate exemplary process steps to produce a disc driveincluding a center hub on a single wafer substrate.

FIGS. 21A-D illustrate exemplary process steps to produce a MEMS discdrive having fluid bearing sliders at the outside diameter of the discin lieu of a center hub to constrain the disc as it rotates.

FIG. 22 illustrates a micromachined four-bar linkage actuator andsuspension for a head.

FIGS. 23A-B illustrate techniques for manufacturing disc drive headactuators using MEMS techniques.

DETAILED DESCRIPTION

FIGS. 1A-1C illustrate disc dive 100 manufactured using MEMS techniques.FIGS. 1A and 1B are exploded peripheral views of disc drive assembly100. FIG. 1C shows a disc drive 100 as manufactured. Various componentsof disc drive assembly 100 are manufactured using MEMS fabricationtechniques. Generally speaking, MEMS is the integration of mechanicalelements, sensors, actuators, and/or electronics on a substrate usingmicrofabrication technology. The term “substrate” is used genericallyused throughout this document. For example, the term substrate issynonymous for terms such as sheet, wafer, film, platen, platform, plateand base as commonly used by those of skill in the art.

As an example, the substrate may be silicon commonly used to makeintegrated circuits (ICs). MEMS components of disc drive assembly 100are fabricated using microfabrication process sequences. Micromechanicalcomponents, e.g., actuator assembly 112, are fabricated using compatible“micromachining” processes that selectively etch away parts of thesilicon wafer or add new structural layers to form the mechanical andelectromechanical devices. Micromachining techniques include deposition,etching lithographic and electroplating techniques.

Disc drive assembly 100 includes a base 102, disc 104 and cover 106.Disc drive 100 also includes a seal 122 between cover 106 and base 102to prevent external contaminants from entering an internal environmentof disc drive 100 through a seam formed between cover 106 and base 102.Seal 122 also allows disc drive to contain a fluid. For example, in someembodiments the internal environment may hold helium, or in otherembodiments a liquid. For example, an internal environment holding aliquid may be useful to provide a boundary layer between moving parts ofdisc drive assembly 100.

Electronics 120 and actuator assembly 112 are mounted to base 102. Base102 also includes integrated disc actuator electrodes 108. Electrodes108 interact with elements integrated into disc 104 to rotate disc 104about bearing 110 electrostatically. Actuator assembly 112 includes head118 to read and/or write or data from disc 104. Actuator assembly 112also includes coil 114, e.g., coil 114 may be a voice coil, whichinteracts with permanent magnet 116 to actuate actuator assembly 112 toplace head 118 in a desired position relative to disc 104. Otherembodiments use other actuation methods such as electromagneticactuation. Integrated components of base 102 may be created usingmicrofabrication processes performed on a single substrate wafer. Insome embodiments, microfabrication processes may be used to form morethan one of bases 102 on a single wafer.

Like base 102, cover 106 may include integrated components manufacturedusing a batch fabrication process, which may provide manufacturability,cost, and/or performance improvements. For example, permanent magnet 116may be integrated with cover 106. As shown if FIG. 1B, cover 106includes an integrated environmental control component 128. Integratedenvironmental control component 128 may be a resistive element to heatdisc drive 100 and/or a cooler, e.g., Peltier cooling system. Integratedenvironmental control component 128 provides a controlled environmentfor disc drive 100.

In other embodiments, as shown in FIG. 2, disc drive 100 may alsoinclude integrated sensors, such as a thermometer, gyroscope, positionsensor, pressure sensor, or accelerometer. Such sensors may be usedindependently or in conjunction with integrated environmental controlcomponent 128. Sensors and/or integrated environmental control component128 can allow disc drive 100 to respond to changing environmentalconditions and/or to shocks and other events. This may increasereliability of disc drive 100, expand allowable operating conditionsand/or control the effect of thermal expansion on components of discdrive 100.

As shown in FIG. 1A, cover 106 also includes vias 124, which provideconnections between multiple disc drive 100 s arranged in a stack or anarray. For example, as shown in FIG. 1A vias 124 connect to electrodes108. With these connections, electrodes 108 may be activatedsimultaneously to rotate disc 104 with actuation electrodes 108 in oneor more other disc drives 100. Vias 124 may also connect electronics 120between multiple disc drives 100. In this manner, a device having onlysingle disc drive interface may control a stack or an array of discdrives. Electrical studs 126 connect base 102 to vias 124 on cover 106.In disc drive 100, not all vias 124 are paired with one of electricalstuds 128, in other embodiments may include more or less vias 124 and/ormore or less electrical studs 126.

Disc drive 100 may be manufactured according to a variety ofmicromachining operations. For example, in one embodiment, base 102including integrated actuator assembly 112, electronics 120 and discactuator electrodes 108, may be formed on a single wafer. Cover 106 maybe formed on a second wafer. Disc 104 may be formed on the same wafer ascover 106 or base 102, or on its own separate wafer. Assembly of thebase and disc may occur before etching of sacrificial layers around disc104 occurs. In some embodiments, each wafer may contain components formore than one disc drive. Also, separate components may be batchfabricated and assembled in a pick-and-place or batch transfer method.

FIG. 2 illustrates an exemplary disc drive 140 manufactured using MEMStechniques. Disc drive 140 includes a base 164 and a cover 142 that forma sealed housing of disc drive 140. Within the housing, integratedactuation electrodes 150 interact with disc 172 to rotate disc 172 aboutspindle 158. For example, disc 172 may include integrated magnets orelectrostatic elements to receive actuation forces from integratedactuation electrodes 150.

Disc 172 includes a media surface 156, which may comprise, for example,magnetic particles. Disc 172 may optionally include a shield layer (notshown in FIG. 2) below media surface 156 to protect media surface 156from electromagnetic fields cause by actuation electrodes 150 of disc172. Disc 172 may also combine with base 164 to form a fluid bearingthat creates a boundary layer to keep disc 172 from contacting base 164during operation of disc drive 140. As referred to herein, a fluidbearing includes two surfaces that support a pressurized layer of fluidbetween the two surfaces to limit or prevent contact between the twosurfaces during movement of one surface relative to the other surface.For example, one of the two surfaces may be textured to produce adesirable pressurized boundary layer of fluid between the two surfacesduring movement of one surface relative to the other surface. Spindle158 may also include fluid bearings to prevent disc 172 from contactingspindle 158 during operation of disc drive 140. In this manner, disc 172is constrained not only by spindle 158, but also by boundary layer fluidpressure forces from fluid bearings. The bearing fluid could be a liquidor a gas.

Actuator arm 162 holds head 160 in close proximity to media surface 156.Head 160 traverses media surface 156 of disc 172 to read from and/orwrite to media surface 156. For example, actuator arm 162 may actuatehead 160 with a stroke of at least 0.5 millimeters. The stroke is themaximum movement distance of head 160 in a plane parallel to mediasurface 156 provided by the range of motion of actuator arm 162. Asother examples, actuator arm 162 may actuate head 160 with a stroke ofat least 1 millimeter, with a stroke of at least 3 millimeters, with astroke of at least 5 millimeters, with a stroke of at least 10millimeters, with a stroke of at least 15 millimeters, with a stroke ofat least 20 millimeters, or with a stroke of at least 25 millimeters.

Coil 170 interacts with magnet 152 to actuate actuator arm 162 aboutbearing 168. MEMS techniques provide for very precise layer thicknessessuch that smaller tolerances need to be taken into account in the designof disc drive 140. For this reason, coil 170 may be located at adistance of less than 25 micrometers from magnet 152. For example, coil170 may be located at a distance of less than 20 micrometers from magnet152. As other examples, coil 170 may be located at a distance of lessthan 15 micrometers from magnet 152, a distance of less than 10micrometers from magnet 152, or a distance of less than 5 micrometersfrom magnet 152. In other embodiments, the locations of magnet 152switched with coil 170 such that magnet 152 is part of actuator arm 162and coil 170 is fixed to cover 142. In other embodiments, magnet 152 maybe replaced a coil that interacts with coil 170. Such embodiments alsoallow for a gap between the two coils that is as small as the gapbetween coil 170 and magnet 152.

Disc drive 140 includes many features that would be difficult or evenimpossible to include in disc drive manufactured using conventionaltechniques. For example, disc drive 140 includes motion limiters 163.Because MEMS techniques provide for very precise layers, motion limiters163 are located in close proximity to actuator arm 162. For example,motion limiters 163 may be located at a distance of less than 25micrometers from actuator arm 162 or a distance of less than 20micrometers from actuator arm 162. As other examples, motion limiters163 may be located at a distance of less than 15 micrometers fromactuator arm 162, a distance of less than 10 micrometers from actuatorarm 162, or a distance of less than 5 micrometers from actuator arm 162.

As another example, disc drive 140 includes an integrated sensor 146.Integrated sensor 146 may be, e.g., a thermometer, gyroscope, positionsensor, pressure sensor, humidity sensor or accelerometer. Integratedsensor 146 may measure ambient conditions within the drive which may beuseful to, e.g., to control head-disc spacing. As another example,integrated sensor 146 may be used to detect shocks. For example, in theevent of a shock, head 160 may be moved away from media surface 156 toprevent damage to media surface 156.

Disc drive 140 also includes an integrated environmental controlcomponent 154, which may include one or both of a resistive heatingelement and/or a Peltier cooling system. Disc drive 140 may also includecontrol circuitry integrated within its housing. In this manner, discdrive 140 does not require a separate printed circuit board to controlits operation. However, disc drive 140 may mount to a printed circuitboard as part of a larger device, e.g., a cell phone or other consumerelectronic device.

Disc drive 140 further includes vias 148 integrated into its housing;vias 148 include an electrically conductive paths 149, which may allowmultiple disc drive 140 provide an interface for another disc drive. Forexample, disc drive 140 may mount to a printed circuit board and anotherdisc drive may mount on top of disc drive 140 using bond pads 144 andcommunicate with the printed circuit board through electricallyconductive paths 149 of vias 148.

FIG. 3 shows an exploded view of integrated recordable disc and motor260. Integrated disc and motor 260 utilizes ability to patternconductors, electrodes and/or magnets on or in disc 262 with exceptionalprecision using MEMS fabrication methods. Integrated disc and motor 260is shown with disc 262, case 263, center hub 266, actuation electrodes264 and seal 267. Other configurations of an integrated recordable discand motor are also possible. For example, center hub 266 may not berequired if fluid bearings axially constrain disc 262, e.g., such fluidbearings may be located at the outside diameter of disc 262.

Integrated disc and motor 260 comprises a microfabricated disc actuationmechanism, which may be manufactured utilizing the batchmicrofabrication processes. Integrated disc and motor 260 may be acomponent of a small form factor disc drive, e.g., a disc drive having aform factor of one inch or less. Small form factor disc drive designsbenefit from small and precise gaps, integrated features or components,and well aligned patterning provided by MEMS techniques. One actuationmechanism that could be implemented into integrated disc and motor 260is an electrostatic media motor. In the media motor, electrical fieldsgenerated by voltages applied to actuation electrodes 264 interact withthe bottom surface of disc 262, which is a dielectric material such asglass, inducing charges in the dielectric material of the disc. Theinduced charges in the disc interact with the electric field fromelectrodes 264 to generate a force to rotate disc 262. Actuationelectrodes 264 also function as a textured fluid bearing surface supportdisc 262 as it spins. Hub 266 contains the position of disc 262 usingfluid and mechanical bearing forces. Optionally, actuation electrodes264 may provide an electrostatic actuation force on disc 262 to preloadfluid bearings during rotation of disc 262. While FIG. 3 shows actuationelectrodes acting only one side of disc 262 additional actuationelectrodes may placed on both sides of the disc surface.

A similar disc actuation mechanism to an electrostatic media motor is acapacitive electrostatic actuation motor. For a capacitive electrostaticactuation motor, disc 262 includes patterned electrodes on its surface.The location of electrodes on disc 262 may vary. For example electrodesmay be positioned at the center of disc 262, throughout the surface ofdisc 262, only at the outside diameter of disc 262 or otherwise.

For a capacitive electrostatic actuation motor, the electrodes on disc262 are preferably kept at a set potential (e.g. ground) while actuationelectrodes 264 are individually controlled to apply electrostaticattractive forces to rotate disc 262. Voltages to subsets of actuationelectrodes 264 are varied with a correctly chosen frequency to provide aconstant torque on disc 262.

In another embodiment, integrated disc and motor 260 may combine to forma permanent magnet motor. For example, disc 262 may include integratedpermanent magnets and may serve as the rotor for the permanent magnetmotor, while actuation electrodes 264 are replaced by electromagneticcoils which function as the stator.

Integrated disc and motor 260 may include additional features not shownin FIG. 3 For example, disc 262 may include multiple layers to optimizeactuation output or shield a media surface from a magnetic field createdby electromagnetic coils or permanent magnets. Disc 262 and/or actuationelectrodes 264 may, in addition to forming part of one or more fluidbearings, also include patterned geometry to optimize actuation output.Instead of, or in combination with fluid bearings, integrated disc andmotor 260 may include magnetic layers for magnetic bearings at movingcomponent interfaces. Disc 262 and/or actuation electrodes 264 may alsoinclude geometry, e.g., at the outer diameter of disc 262, to enhanceshock and disc run-out performance. For example, integrated shockmitigation features may include small-gap limiters or active or passiveactuated locking mechanisms, e.g., a piezoelectric “disc clamp”, tominimize the effects of shock upon a sensed acceleration event.Described actuation mechanisms are merely exemplary and may be modifiedconsistent with principles of the invention. For example, embodimentsmay utilize a combination of the described actuation mechanisms.

FIG. 4 is a close-up view of integrated recordable disc and motor 270.Integrated recordable disc and motor 270 includes a disc 274, a base 276with actuation electrodes 278, and a cover 272. Components of integratedrecordable disc and motor 270 may formed using MEMS processes on asingle wafer substrate or may be formed on multiple substrates and laterassembled, e.g., using pick and place techniques.

Disc 274 includes surface features that optimize actuation forces fromactuation electrodes 278; these surface features may also form atextured fluid bearing surface. Actuation electrodes 278 can also form atextured fluid bearing surface, as does cover 272. By providing fluidbearings, integrated recordable disc and motor 270 may achieve arotational velocity of 100,000 revolutions per minute. As otherexamples, integrated recordable disc and motor 270 may achieve arotational velocity of 25,000 revolutions per minute, 50,000 revolutionsper minute, and/or 75,000 revolutions per minute. At high rotationalvelocity, the dynamics of fluid bearings change, which must beincorporated into the design of fluid bearing surfaces on base 276 andcover 272. Additionally, this high rotational velocity allows multiplesampling of the same data from recordable disc 274, which is useful fornoise reduction.

MEMS techniques that may be used to produce integrated recordable discand motor 270 allow for high geometric tolerances. Specifically,integrated recordable disc and motor 270 may be produced using etchingamong other techniques. Etching techniques include oxidation smoothingof silicon, hydrogen annealing of silicon, controlled atomic layerdeposition, and/or start-up burnish.

FIG. 5 illustrates electromagnetic induction actuation mechanism 280 forrecordable disc 282. Disc 282 includes an integrated shield layer 284and integrated induction coils 285. Induction coils 285 are shown asfigure-eight coils, but other arrangements may also be utilizedconsistent with principles of the invention. Electromagnetic inductionactuation mechanism 280 further includes electromagnets 283A and 283B(“electromagnets 283”), which apply electromagnetic fields to inductioncoils 285 in order to rotate disc 282. For example, electromagnets 283may be coils through which current passes to produce a magnetic field.Shield layer 284 may protect a media surface of disc 282 fromelectromagnetic forces produced by electromagnets 283.

As shown in FIG. 5, induction coils 285 provide torque at the edge ofdisc 282. Each induction coil 285 has two sides, say side A and side B.A change in magnetic flux through side A, e.g., caused by electromagnet283A, induces an electromotive force on side A of the loop. This causesa current in the induction coil 285. The same current in side A occursin side B. The current through loop B creates a magnetic field. Side Bof the induction coil 285 can be treated as a magnetic dipole.Electromagnet 283B applies a magnetic field gradient at side B, causinga tangential force at the outside diameter of disc 282. This results inthe rotational motion of disc 282.

FIG. 6 illustrates capacitive electrostatic actuation mechanism 288 forrecordable disc 292 capable of capacitive disc sensing. Capacitiveelectrostatic actuation mechanism 288 includes capacitors 292A and 292B(“capacitors 292”) and recordable disc 292 with integrated conductiveplates 293. Plates 293 may be solid elements placed in cavities formedin the disc. In other embodiments, plates 293 may be thin filmsdeposited on the surface, or in shallow recesses in the disc, with thefilm wrapping around the edge of the disc as shown, to electricallyconnect the top side plate to the bottom side plate.

The general concept of capacitive electrostatic actuation mechanism 288is as follows. A voltage applied to one of the capacitors, e.g.,capacitor 292A, tends to pull in the nearest conductive plate 293,attempting to center plate 293 under capacitor 292A to create the lowestenergy condition. The spacing between plates 293 and capacitors 292A and292B is selected so that when a plate is directly centered within onecapacitor, another plate is not centered, but is offset from the othercapacitor. This allows continuous rotation by properly timing thevoltage pulses applied to the two capacitors, so that a torque in thedesired direction is continuously generated. In practice, the number ofcapacitors is usually greater than two. The frequency and phase ofvoltage for capacitor 292A and capacitor 292B may be adjusted to controlthe rotational velocity of disc 290. This type of actuator does notrequire the plates on the disc to be grounded for maximum performance.

FIG. 7 illustrates electromagnetic actuation mechanism 294 forrecordable disc 295. Magnetic components 299 are integrated about theouter diameter of disc 295. Magnetic components 299 may include apermanently magnetized “hard” magnetic material such as aSamarium-Cobalt alloy, or a high permeability “soft” magnetic materialsuch as permalloy. If magnetic components 299 are permanent magnets, themagnetization direction is preferably radial. The direction ofmagnetization in each of magnetic components 299 may alternate with eachof magnetic components 299 or each of magnetic components 299 may havethe same direction of magnetization. Electromagnetic actuation mechanism294 also includes electromagnets 297, fixed about the outer perimeter ofdisc 295.

Similar to electromagnetic induction actuation mechanism 280 in FIG. 5and capacitive electrostatic actuation mechanism 288 in FIG. 6, disc 295is rotated by a torque at its edges. However, other embodiments mayapply a torque at other locations on disc 295. Electromagnets 297 createa magnetic field gradient that reacts with magnetic components 299integrated with disc 295. For example, an external electric circuit maydrive electromagnets 297. Electromagnets 297 may be either single poleor multiple poles. The magnetic field gradient created by electromagnets297 interacts with the magnetic fields of magnetic components 299 tocreate a force on disc 295. The rotational velocity of disc 295 can becontrolled by the applied currents to electromagnets 297.

Electromagnetic actuation mechanism 294 may be adapted to eliminate aneed for a hub or spindle at the center of disc 295. For example,electromagnets 297 may create a centering force on disc 295.Furthermore, fluid bearings may be utilized to further constrain disc295.

FIGS. 8A-B illustrate disc dive 300 including actuator coils 308A-C(coils 308) integrated within base 302. Base 302 combines with cover 306to form a housing of disc drive 300. Disc 304 is situated within thehousing. Disc drive 300 also includes other components not shown inFIGS. 8A-B. For example, disc drive 300 may contain one or more of thefollowing: electronic components, an actuator assembly including a voicecoil, a head and an integrated environmental control component.

Disc 304 is primarily composed of a disc material layer 303, a substratesuch as spin-on glass, but also includes a shield layer 307 and a medialayer 305. Permanent magnets 309, which are magnetizable components, areintegrated with disc 304. Permanent magnets 309 may be evenly spaced onthe bottom surface to disc 304 so that the mass of disc 304 is symmetricabout its center. Permanent magnets 309 function to harnesselectromagnetic field energy created by actuator coils 308 in order torotate disc 304. In some embodiments, disc 304 may not include permanentmagnets 309; e.g., permanent magnets 309 may be replaced with a set ofcoils or coils in conjunction with permanent magnets, or a magneticallysoft permeable material may replace the permanent magnets to harnesselectromagnetic field energy created by actuator coils 308.

Shield layer 307 insulates media layer 305 from electromagnetic fieldsproduced by permanent magnets 309 and/or actuator coils 308. Forexample, if media layer 305 is a magnetic media layer, shield layer 307may prevent undesirable degradation to data stored on media layer 305.In other embodiments, media layer 305 may not be affected byelectromagnetic fields produced by permanent magnets 309 and/or actuatorcoils 308 such that layer 307 may not be necessary. For example, medialayer 305 may only be affected by electromagnetic fields of much greaterstrength than those by permanent magnets 309 and/or actuator coils 308.

Actuator coils 308 are arranged in sets, e.g., actuator coil sets308A-C. For example, actuator coils 308 may rotate disc 304 in thefollowing manner. A current applied to actuator coil 308A attracts thenearest magnet 309 on disc 304. As disc 304 spins and magnet 309 movespast the center of actuator coil 308A, current in actuator coil 308A isturned off and current in actuator coil 308B is turned on, pullingmagnet 309 past actuator coil 308A. Once magnets 309 reach actuator coil308B, current in actuator coil 308B is turned off and current inactuator coil 308C is turned on, pulling magnets 309 towards actuatorelectrodes 308C. The cycle repeats indefinitely.

Disc 304 rotates within a circular aperture formed by the walls of cover306. Disc 304 is constrained not only by the physical position of cover306 and base 302, but also by boundary layers of fluid, e.g., air,around the surfaces of disc 304. Internal surfaces of base 302 and cover306 may include textured fluid bearing surfaces to increase fluidpressure within boundary layers surrounding disc 304 to stabilize disc304 as it rotates. At very high speeds, boundary layers fluid pressuresurrounding disc 304 may prevent disc from contacting base 302 or cover306, even when disc drive 300 is subjected to a substantial shock. Forexample, disc 304 may achieve speeds of 100,000 rpm or greater.

When disc drive 300 is not operating, actuator coils 308 may secure discto base 302, e.g., the position shown in FIG. 8A. This may protect mediasurface of disc 304 to increase reliability of disc drive 300.Furthermore, in the event of a severe shock, disc drive 300 mayautomatically secure disc 304 to base 302 in order to prevent damage tomedia surface 305. Securing disc 304 to base 302 may temporarilyinterruption read/write processes of disc drive 300. However, theoperation of disc drive 300 may immediately be resumed following asevere shock. The interruption resulting from a shock may not benoticeable to a user of disc drive 300. For example, data stored in acache (not shown) may be sufficient to operate a device containing discdrive 300 until disc drive 300 releases disc 304 from actuator coils308. In addition, the high-precision of the drive manufacturing mayallow for creation of mechanical limiters that would limit thedeflection of components to prevent mechanical yielding or damage.

FIG. 8C illustrates an exemplary arrangement of permanent magnets 309 indisc 304. As shown in FIG. 8C, permanent magnets 309 are distributedamong three concentric circles 310. Permanent magnets 309 are equallyspaced within each of concentric circles 310 such that the mass of disc304 is symmetric about its center.

FIGS. 9-12 illustrate recordable disc axially constrained by fluidbearings. In different embodiments, fluid bearings may operate usingair, other gasses or liquids. In FIG. 9 recordable disc 320 is centeredon hub 322. Axial bearing 324 includes fluid bearing features to form acontrolled, non-contact pressurization when disc 320 rotates. Forexample Axial bearing 324 may comprise subtle or pronounced “fin” or“step” type structures to create a controlled fluid pressurization gapfor a spinning disc. For example, axial bearing 324 may include groovedfluid dynamic thrust gas bearings.

FIG. 10 illustrates recordable disc 328 constrained by ring of fluidbearings 332 at the outer diameter of recordable disc 328. FIG. 10 issimilarly to FIG. 9 except that it does not include a center hubutilizing outer fluid bearing features for radial support. Insteadrecordable disc 328 is constrained by fluid bearings 332 at its outerdiameter. Fluid bearings 332 form a boundary layer that interact withbase 330 to center disc 328.

FIG. 11 illustrates recordable disc 340 centered on hub 342 includingcentering fingers 344 with textured fluid bearing surfaces. FIG. 11includes a variation on the center hub design of FIG. 14. Center hub 342includes “fingers” 344, which have textured fluid bearing surfaces atcontact points with disc 340. Fingers 344 allow for adjustment, e.g.,due to shocks or defects.

FIG. 12 illustrates recordable disc 358 constrained by a ring ofcentering fingers 352 with fluid bearings at the outer diameter ofrecordable disc 358. FIG. 12 shows fingers 352 at the outer diameter ofdisc 358. Fingers 352 are fixed to base 350 and include fluid bearingsat the contact points with disc 358. Fingers 352 provide radial supportand allow for adjustment, e.g., due to shocks or defects.

FIGS. 13A-B are cross-section illustrations of disc dive 360 includingactuators 368 integrated within base 362. Disc drive 360 is also shownwith recordable disc 366 on center hub 364. Disc drive 360 includesadditional features not shown in FIG. 13. For example, disc drive 360includes a head mounted to an actuator (not shown) to read and/or writedata to recordable disc 366. In different embodiments, recordable disc366 can be either a flexible or rigid recordable disc. In embodimentswhere recordable disc 366 is flexible, centripetal force may in whole orin part contribute to causing disc 366 to be substantially flat duringoperation of disc drive 360.

FIG. 13A shows disc dive 360 while in operation. Actuators 368 provideelectrostatic and/or electromagnetic forces on recordable disc 366 torotate flexible recordable disc 366 about center hub 364, an axialbearing for recordable disc 366.

If disc 366 is sufficiently compliant, when disc drive 360 is notoperating, actuators 368 or a subset thereof may secure disc to base362, e.g., the position shown in FIG. 13B. This may protect the mediasurface of disc 366 to increase reliability of disc drive 360.Furthermore, in the event of a severe shock, disc drive 360 mayautomatically secure disc 366 to base 362 in order to prevent damage tothe media surface. Securing disc 366 to base 362 may temporarilyinterruption read/write processes of disc drive 360. However, theoperation of disc drive 360 may immediately be resumed following asevere shock. The interruption resulting from a shock may not benoticeable to a user of disc drive 360. For example, data stored in acache (not shown) may be sufficient to operate a device containing discdrive 360 until disc drive 360 releases disc 366 from actuators 368. Inaddition, in embodiments where recordable disc 366 is flexible,recordable disc 366 can provide a compliant surface while ahead/suspension/actuator (not shown in FIGS. 13A-B) remains rigid. Thisis in contrast to a conventional disc drive designs that utilize arigidly supported recordable disc and a compliant gimbal suspensionstructure.

Center hub 364 may include textured fluid bearing surfaces to create aboundary layer between the rotatable portions of center hub 364 and thefixed spindle of center hub 364 during operation of disc drive 360.During operation, disc 366 is constrained not only by center hub 364,but also by boundary layers of fluid, e.g., air, around the surfaces ofdisc 366. Furthermore, centripetal force may keep disc 366 substantiallyflat during operation. Base 362 may include fluid bearing surfaces toincrease fluid pressure within boundary layers surrounding disc 366 tostabilize disc 366 as it rotates. At very high speeds, boundary layersfluid pressure surrounding disc 366 may prevent disc from contactingbase 362, even when disc 360 is subjected to a substantial shock. Forexample, disc 366 may achieve speeds of 100,000 rpm or greater.

FIG. 14 shows disc drive 380 including recordable disc 386 mounted oncenter hub 384, an axial bearing for recordable disc 366. Center hub 384is designed to provide radial and axial thrust bearing support forrecordable disc 386 because its surface is at an angle relative to therotational plane of disc 386. A mechanical bearing that utilizes a smallgap between stationary hub 384 and disc 386 during operation of discdrive 380. For example, this gap may be fabricated with a thinsacrificial film. A protective coating over the interface of hub 386 anddisc 386 may reduce wear, provide mechanical robustness or evenlubrication. For example, a protective coating could be applied as athin film in the regular process flow, or could be applied towards theback end of the processing.

Axial bearing structures other than those shown in FIGS. 13 and 14 arealso possible. For example, an additional bearing element may be used toprevent static friction and resulting wear during very low speedoperation as seen at start and prior to stop. For example, an INCABLOC™type bearing element may be used. An additional bearing element maydefine a wider range of axial rotor location than the primary bearingelements that are effective close to nominal speed.

FIG. 15A illustrates disc drive 390 including recordable disc 392 andhousing 393. Housing 393 includes multi-level support fluid bearings394. Multi-level support fluid bearings 394 may be fabricated usingmultiple layers and MEMS processes, including wafer bonding, etc.Multi-level support fluid bearings 394 may provide stability torecordable disc 392 by having a large surface area and throughmulti-directional support of recordable disc 392.

FIG. 15B illustrates disc drive 395 including recordable disc 396 andhousing 397. Disc drive 395 includes fluid bearings 398 and 399. Asshown in FIG. 15B, fluid bearings 398 include a textured fluid bearingsurface on recordable disc 396, while fluid bearings 399 include atextured fluid bearing surface on housing 397. Other embodiments mayinclude fluid bearings with two opposing textured fluid bearing surfacesforming a single fluid bearing.

FIG. 16 illustrates MEMS process steps I-V for the manufacture oflevitating rotary bearing 418. In step I, base wafer 400 is etched withcavity 401. For example, base wafer may comprise silicon. In step II,electromagnet 402 patterned on top of cavity 401. For example,electromagnet 402 may include coils and magnetic material.

Step III requires multiple MEMS processes. First, sacrificial layer 406is deposited with a constant thickness. Second, magnetic material 408 isdeposited into what remains of cavity 401. Third, disc material 410 isdeposited. For example, disc material 410 may be a spin-on-glass.

Step IV, also requires multiple MEMS processes. First, a sacrificiallayer (not shown) is deposited on top of disc material 410. Thesacrificial layer may form fluid bearing geometry. Second, covermaterial 412 is deposited on the sacrificial layer. For example, covermaterial 412 may comprise the same substance as base wafer 400. Covermaterial 412 takes the shape of the sacrificial layer, including fluidbearing features. Third, the sacrificial layer is etched along withsacrificial layer 406, releasing disc material 410.

A Step V shows levitating rotary bearing 418 in operation. Electromagnet402 creates forces 414 to levitate and axially constrain disc material410. An actuation mechanism (not shown) rotates disc material 410. Forexample, an electrostatic or electromagnetic actuation mechanism may beused. Fluid bearings on cover material 412 create forces 416 to create aconstant fly height. Because forces 416 oppose forces 414, disc material410 is constrained axially and vertically. In this manner, rotarybearing 418 does not require a central hub or fluid bearing features atthe outer diameter of disc material 410.

FIG. 17 illustrates annular chuck mechanism 420 with an adjustableinternal diameter. Chuck mechanism 420 provides adjustable geometry toreduce or eliminate the gap between hub 422 and chuck mechanism 420. Forexample, chuck mechanism 420 may comprise piezoelectric,magnetostrictive, and/or thermal actuation structure. Chuck mechanism420 couples to a recordable disc (not shown) and combines with hub 422to form a bearing for the disc. Minimizing any gaps between hub 422 andchuck mechanism 420 increases the precision of rotational movement ofthe recordable disc. Precise rotational movement is required to increasetrack density on a magnetic media for example. Chuck mechanism 420provides process robustness and allow greater tolerances manufacturedgaps between hub 422 and chuck mechanism 420. Even though there may be alarge gap between hub 422 and chuck mechanism 420 after fabrication, thegap can be controlled by shrinking chuck mechanism 420. Chuck mechanism420 may also be used to minimize effects of shock by “locking down” orgrabbing onto hub 422 during a sensed shock or acceleration event.

FIG. 18 illustrates recordable disc 424 and adjustable outer diameterfluid bearing 426. Adjustable outer diameter fluid bearing 426 providesadjustable geometry to reduce or eliminate the gap between recordabledisc 424 and adjustable outer diameter fluid bearing 426. For example,adjustable outer diameter fluid bearing 426 may comprise piezoelectric,magnetostrictive, and/or thermal actuation structure. Adjustable outerdiameter fluid bearing 426 minimizes the gap at the outer diameter ofdisc 424. Adjustable outer diameter fluid bearing 426 may provide manyof the same advantages as chuck mechanism 420 shown in FIG. 17.Adjustable outer diameter fluid bearing 426 improves the precision ofrotational movement of disc 424 by adjusting the outside diameter radialtextured fluid bearing surface position relative to disc 424. In thismanner, adjustable outer diameter fluid bearing 426 optimize gapsbetween the textured fluid bearing surface and disc 424. Adjustableouter diameter fluid bearing 426 may also be used to minimize effects ofshock by “locking down” or grabbing onto disc 424 during a sensed shockor acceleration event.

FIGS. 19A-C illustrate exemplary process steps to produce MEMS discdrive 500 having a center hub to constrain the disc as it rotates. FIG.19A shows MEMS process steps I-XI performed on a first wafer substrate504 to create integrated base and disc 522. FIG. 19B shows cover 538created on a second wafer substrate 530. FIG. 19C shows cover 538 bondedto integrated base and disc 522 forming disc drive 500. One or moremanufacturing processes may be required between each step shown in FIGS.19A-C.

As shown in FIG. 19A, integrated base and disc 522 is produced from asingle wafer using a series of MEMS processes. Steps I-III form thebasic disc geometry of integrated base and disc 522. In step I patternedsacrificial layer 502 is molded to substrate 504. For example, patternedsacrificial layer 502 may be SiO₂. Patterned sacrificial layer 502 maybe shaped to create fluid bearings for the disc of integrated base anddisc 522. In step II, disc material 506 is deposited on top of patternedsacrificial layer 502. For example, disc material 506 may be spun-onglass. In step III, disc material 506 is planarized. A deposition step(not shown) may be used to add a shield layer and/or media layer, e.g.,a magnetic media layer, to disc material 506.

Steps IV-VII form the hub of integrated base and disc 522. The hubconstrains the disc as it rotates. In step IV hub geometry 510 is etchedinto disc material 506 and sacrificial layer 502. For example, hubgeometry 510 may contain fluid bearing sliders to increase boundarylayer fluid pressure of the disc as disc drive 500 operates. In step V,hub sacrificial layer 512 is deposited and patterned. For example,sacrificial layer 512 may be the same material as patterned sacrificiallayer 502, e.g., SiO₂. In step VI, hub material 514 is deposited. Forexample, hub material 514 may be polysilicon. For step VII, hub material514 is planarized to complete the shape of the hub of integrated baseand disc 522.

Steps VIII and IX form add the media surface to the disc of integratedbase and disc 522 and finish the shape of the disc. In step VIII, medialayer 516 is deposited and patterned. For example, media layer 516 maybe a thin film magnetic media. For step IX, disc geometry is patternedby etching gap 518 through media layer 516, disc material 506 and intopatterned sacrificial layer 502.

Steps X and XI complete integrated base and disc 522. In step X,sacrificial layer 520 is deposited and patterned as a protective layerin order to protect integrated base and disc 522 during back endprocessing steps, such as singulation of separate components. Forexample, sacrificial layer 520 may be the same material as sacrificiallayer 512 and patterned sacrificial layer 502, e.g., SiO₂. In step XI,sacrificial layer 520, sacrificial layer 512 and patterned sacrificiallayer 502 are etched. For example, etching may be performed usinganhydrous HF and alcohol vapor etch. After etching disc material 506 isreleased from substrate 504, and the disc may rotate freely about thehub.

FIG. 19B shows cover 538 created on a second wafer substrate 530. Forexample, substrate 530 may comprise silicon. Cover 538 may be createdusing bulk micromachining processes. Cover 538 also includes patternedbonding material 532. Cover 538 may additionally include an integratedpermanent magnet to interact with a voice coil of an actuator assemblyand/or an environmental control component.

FIG. 19C shows cover 538 bonded to integrated base and disc 522 formingdisc drive 500. Cover 538 is held to the base of integrated base anddisc 522 with bonding material 532. Bonding material 532 creates ahermetic seal to contain fluids within disc drive 500. For examplefluids contained within disc drive 500 may be helium or other gaseous orliquid fluids.

Processes other than those described, may also be used in themanufacture of disc drive 500. For example, burnishing could be used tocorrect for small defects. Also, disc drive 500 may include additionalfeatures not shown in FIGS. 19A-C. For example a protective coating maybe added to hub 510 or elsewhere for lubrication or mechanicalrobustness. For example, disc drive 500 also includes an actuatorassembly and may also include actuator electrodes integrated within itsbase and permanent magnets integrate within its disc. For example, discdrive 500 may include an integrated sensor, e.g., a thermometer,gyroscope or accelerometer. Disc drive 500 may also include anintegrated environmental control component, e.g., a resistive heatingelement and/or a Peltier cooling system. Disc drive 500 may also includecontrol circuitry integrated within its housing. Each of these featuresmay be manufactured using MEMS techniques as part of the first wafer,the second wafer or one or more additional wafer(s).

The techniques described with respect to FIG. 19 for depositing the discstructure allow integration of disc and disc actuator including featuressuch as electrodes or magnets. Alternatively, a disc may microfabricatedout of a bulk material, e.g., silicon and used with other conventionallymanufactured disc drive components.

FIGS. 20A-C illustrate disc drive 600 including a center hub formed fromsingle wafer substrate 602 and micromachine process steps for itsmanufacture. FIGS. 20A-C illustrate steps I-XIII, each step representinga point in the manufacturing process of disc drive 600. One or moremanufacturing processes may be required between each step shown in FIGS.20A-C.

Steps I and II, shown in FIG. 20A, produce a base and disc actuationcomponent for disc drive 600. In step I, wafer vias 604 and sensor 607are patterned in wafer substrate 602. In this manner, wafer vias 604 andsensor 607 are integrated within the housing of disc drive 600. Forexample wafer substrate 602 may be a silicon wafer substrate. Wafer vias604 may provide electrical connections, e.g., power and/or data signalconnections, for disc drive 600. Additional electrical connection paths(not shown) may also be patterned in wafer substrate 602. Sensor 607 maybe, e.g., a thermometer, gyroscope or accelerometer. In step II,actuation electrodes 612 deposited and patterned. Spacer layer 608 isalso deposited and patterned in step II. For example, spacer layer 608may comprise silicon. Spacer layer 608 is patterned to integrate vias604 within the housing of disc drive 600.

Steps III-V, shown in FIG. 20A, produce a recordable disc of disc drive600. In step III, sacrificial layer 614 is deposited. For example,sacrificial layer 614 may comprise germanium. Sacrificial layer 614 isshown with fluid bearing features. In step IV, first disc material layer616 is deposited. For example, disc material layer 616 may comprisespin-on glass. After disc material layer 616 is deposited, media surface617 is deposited on top of disc material layer 616. For example, mediasurface 617 may include magnetic particles. In step V, disc materiallayer 616 including media surface 617 is patterned and etched to formthe shape of the recordable disc. The disc pattern may include texturedfluid bearing surfaces.

Steps VI and VII, shown in FIG. 20B, produce center hub 610 for discdrive 600. In step VI, sacrificial layer 618 is deposited. For example,sacrificial layer 618 may consist of the same substance as sacrificiallayer 614. For example, sacrificial layer 618 may comprise germanium.Sacrificial layer may include fluid bearing features (not shown) forcenter hub 610. In step VII, center hub 610 is deposited on top ofsacrificial layer 618.

Steps VIII and IX, shown in FIG. 20B, produce actuator arm 621 for discdrive 600. In step VIII, sacrificial layer 618 is etched. In step IX,actuator arm 621 is deposited and patterned on top of sacrificial layer618. Actuator arm 621 includes head 623 and coil 622.

The manufacturing process of disc drive 600 completes with steps X-XIII,as shown in FIG. 20C. In step X, top sacrificial layer 627 is deposited.For example, top sacrificial layer 627 may consist of the same substanceas sacrificial layers 614 and 618. For example, top sacrificial layer627 may comprise germanium. In step XI, environmental control component631 and permanent magnet 629 are deposited and patterned. Environmentalcontrol component 631 may include one or both of a resistive heatingelement and/or a Peltier cooling system. When disc drive 600 isoperational, coil 622 interacts with magnet 629 to actuate actuator arm621. In other embodiments, magnet 629 maybe replaced with a coil tointeract with coil 622.

In Step VII, top layer 634 is deposited and planarized. For example, toplayer 634 may consist of the same material as wafer substrate 602,spacer layer 608 and center hub 610. E.g., top layer 634 may comprisesilicon. In step XII, sacrificial layers 614, 618 and 627 are removed.For example, sacrificial layers 614, 618 and 627 may be removed usingliquid or vapor etching techniques.

Disc drive 600 may include additional features not shown in FIGS. 20A-C.For example, disc drive 600 may contain control circuitry integrated andadditional electrical connection vias integrated within its housing.Each of these features may be manufactured using MEMS techniques.

FIGS. 21 A-D illustrate exemplary process steps to produce MEMS discdrive 700 having fluid bearing sliders at the outside diameter of thedisc to constrain the disc as it rotates. FIG. 21A shows cover 708created on a first wafer substrate 702. FIG. 21B shows MEMS processsteps I and II performed on a second wafer substrate 710 to createintegrated base and actuator electrodes 715. FIG. 21C shows MEMS processsteps I-V performed on a third wafer substrate 716 to create integrateddisc and outer diameter fluid bearing 728. FIG. 21D shows MEMS processsteps I-III to combine cover 708, integrated base and actuatorelectrodes 715 and integrated disc and outer diameter fluid bearing 728to form disc drive 700. One or more manufacturing processes may berequired between each step shown in FIGS. 21A-D.

FIG. 21A shows cover 708 created on a first wafer substrate 702. Forexample, substrate 702 may comprise silicon. Cover 708 may be createdusing bulk micromachining processes. Cover 708 also includes patternedbonding material 704. Cover 708 may additionally include an integratedpermanent magnet to interact with a voice coil of an actuator assemblyand/or an environmental control component.

FIG. 21B shows MEMS process steps I and II performed on a second wafersubstrate 710 to create integrated base and actuator electrodes 715. Instep I, through-wafer electrical vias 712 are created through wafersubstrate 710. For example, substrate 710 may comprise silicon. In stepII, actuator electrodes 714 are deposited and patterned using actuatorelectrode patterns 712.

FIG. 21C shows MEMS process steps I-V performed on a third wafersubstrate 716 to create integrated disc and outer diameter fluid bearing728. In step I, sacrificial layer 718 is deposited on wafer substrate716. For example, substrate 716 may comprise polished silicon. In stepII, fluid bearing material 720 is deposited. For example, fluid bearingmaterial 720 may be polysilicon. In step III, fluid bearing material 720is patterned. For step IV, media layer 722 is deposited and patterned.For example, media layer 722 may be a thin film magnetic media. For stepV, patterned bonding material 724 is added to the bottom of fluidbearing material 720.

FIG. 21D shows MEMS process steps I-III to combine cover 708, integratedbase and actuator electrodes 715 and integrated disc and outer diameterfluid bearing 728 to form disc drive 700. In step I, integrated disc andouter diameter fluid bearing 728 is bonded to integrated base andactuator electrodes 715. In step II, sacrificial layer 718 is etched.For example, etching may be performed using anhydrous HF and alcoholvapor etch. Step II releases the disc from the fluid bearings. In stepIII, cover 708 is bonded integrated base and actuator electrodes 715with bonding material 704. Bonding material 704 creates a hermetic sealto contain fluids within disc drive 700. For example fluids containedwithin disc drive 700 may be helium or liquid fluids.

Disc drive 700 may include additional features not shown in FIGS. 21A-D.For example, disc drive 700 also includes an actuator assembly and mayalso include actuator electrodes integrated within its base andpermanent magnets integrate within its disc. Disc drive 700 may includean integrated sensor, an integrated environmental control componentand/or integrated control circuitry. Each of these features may bemanufactured using MEMS techniques as part of the first wafer, thesecond wafer or additional wafer(s).

FIG. 22 illustrates micromachined four-bar linkage actuator 230 thatsupports head 236. The suspension structure of actuator 230 includesbeams 232 mounted to plates 234, flexural bearings 238 and head 236.Flexural bearings 238 provide, in combination with beams 232 and plates234, a single degree of motion for head 236. Actuator 230 also includeshead 236 and integrated electrical interconnects to drive coil 235 andhead 236. Actuator 230 is an integrated head suspension, actuation coiland bearing structure.

Flexural bearings 238 have small heights as measured along their axis ofrotation. For example, flexural bearings 238 may have heights of lessthan 5 millimeters. As other examples, flexural bearings 238 may haveheights of less than 4 millimeters, of less than 3 millimeters, of lessthan 2 millimeters or of less than 1 millimeter. The small heights offlexural bearings 238 allow for a disc drive design with a lowerZ-height.

Actuator 230 moves using coil 235 by creating an electromagnetic fieldto interact with a permanent magnet fixed to a housing of a disc drive.Actuator 230 also includes secondary actuation mechanism 237 integratedwith head 236 to provide fine positioning of the head 236 relative to amedia surface of the disc drive. Secondary actuation mechanism 237 mayinclude, for example, one or more piezoelectric crystals.

A constant force is required to counteract the elasticity of flexuralbearings 238 to hold actuator 230 in a position other than a centeredposition. While actuator 230 includes coil 235 for primary actuation,other embodiments may be actuated by different means. For example,thermal, electrostatic, piezoelectric and electro-active polymeractuation techniques may be used. In another example, coil 235 may bereplaced with a magnet and interact with a fixed-position coil. Coil 235may be formed by electroplating, winding or constructed as a flexiblecircuit and assembled onto actuator 230. For example, assembly mayincludes pick and place techniques.

Flexural bearings 238 may be made from multiple layers fabricated usingMEMS techniques. Each of the layers in flexural bearings 238 only flexesa small portion of the total flexture of flexural bearings 238. Themultiples layer allow for high flexibility in flexural bearings 238. Thehigh flexibility of flexural bearings 238 reduces the actuation forcerequired to move actuator 230.

Actuator 230 may be an actuator for a disc drive manufactured using MEMSand/or batch fabrication techniques. For example, actuator 230 may befabricated from electroformed metal. MEMS processes allow a variety ofcomplex features to be integrated as part of actuator 230. For example,integrated conductive paths may be formed within structural componentsof actuator 230, e.g., head 236 may be powered by and communicatethrough such conductive paths. Actuator 230 may also be formed as anintegrated component of a disc drive, e.g., actuator 112 in FIG. 1.

Actuator 230 also includes integrated sensor 239. Integrated sensor 239may be, e.g., a thermometer, gyroscope, position sensor, pressuresensor, or accelerometer. Integrated sensor 239 is located in a positionthat may be useful to detect external shocks which may result in head236 contacting a media surface of a disc. To prevent damage to the mediasurface and to head 236, in the event of a shock, head 160 may be movedaway from media surface 156. As another example, integrated sensor 1239may measure ambient conditions within a disc drive of actuator 230 whichmay be useful to, e.g., to control head-disc spacing.

Actuator 230 has many advantages. The four-bar design of actuator 230may minimize skew and improve the performance of head 236 by maintaininga precise distance above a media surface in a disc drive (not shown).Furthermore, coil 235 may be plated at the same time as thecorresponding permanent magnet, which allows for a very small gapbetween the permanent magnet and coil 235. This small spacing increasesthe force that may be achieved to drive actuator 230, or, alternatively,a much smaller permanent magnet and/or coil. This increase in efficiencyallows for a disc drive design with a reduced package height. Alsoactuator 230 can incorporate a head gimbal assembly with slider motionlimiters with very small tolerances. For example, tolerances of lessthen ten micrometers are possible.

Beams 222 may be formed using electroplating and multiple patternlayers. For example, beams 222 may include an internal three-dimensionaltruss structure to increase strength and stiffness of beams 222, whilereducing weight.

FIGS. 23A-B illustrate techniques for manufacturing disc drive headactuator 630 and disc drive head actuator 632 using MEMS techniques.Actuators 630 and 632 may be the same as actuator 230 of FIG. 22. Theviewpoint for FIGS. 23A-B is shown as line A-A in FIG. 22. Actuators 630and 632 are formed in incremental layers on substrate 602. Actuators 630and 632 may include internal three-dimensional truss structures.

Steps I, II, III, and IV, shown in FIG. 23A, produce layer 622, which isthe first layer of structure for actuator 630. In step I, plating seedlayer 604 is deposited on substrate 602 and sacrificial structures 606are patterned on plating seed layer 604. For example, plating seed layer604 may be copper. In step II, sacrificial layer 608 is plated on top ofplating seed layer 604. For example, sacrificial layer 608 may becopper. In step III, sacrificial structures 606 are removed and thefirst layer of structural material 610 is electroplated on top of themold formed by sacrificial layer 608. As an example, structural material610 may be a Nickel alloy. In step IV, layer 622A is completed byplanarizing to produce the desired height of layer 622A.

The process of steps I-IV are repeated as shown in steps V-VII toproduce layer 622B, which is the second layer of structure for actuator630. In step V, sacrificial structures 612 are patterned layer 622A andsacrificial layer 613 is plated on top of sacrificial structures 612 andpatterned layer 622A. For example, sacrificial layer 613 may be copper.In step VI, sacrificial structures 612 are removed and the second layerof structural material 614 is electroplated on top of the mold formed bysacrificial layer 613. As an example, structural material 613 may be aNickel alloy. In step VII, layer 622B is completed by planarizing toproduce the desired height of layer 622B.

These process steps are repeated again for each of layers 622C-622H toproduce the structure shown in step VIII. In step IX, the sacrificialmaterial including sacrificial layer 608 and sacrificial layer 613 isremoved using wet or dry etching. This releases actuator 630 fromsubstrate 602.

FIG. 23B illustrates process steps for adding an actuation coil to thestructure of an actuator manufactures as shown in FIG. 23A. Step I isthe same as shown in step VIII of FIG. 23A. In step II, insulative layer640 is patterned on top of the actuator structure material. In step III,metal coil structures 644 is deposited or patterned on top of insulativelayer 640. In step, IV, insulative layer 646 is patterned on top metalcoil structures 644 and insulative layer 640. In step V, the sacrificialmaterial is removed using wet or dry etching. This releases actuator 632from substrate 602.

Actuators 630 and 632 may include additional features not shown in FIGS.23A-B. For example, actuators 630 and 632 may be integrated with a headused to read to or write from a media disc in a disc drive. Actuators630 and 632 may also contain integrated control circuitry integrated andadditional electrical connection vias. Each of these features may bemanufactured using MEMS techniques. The same steps as illustrated inFIGS. 23A-B may also be used to manufacture more than one disc drivehead actuator on a common substrate.

A number of embodiments of the present invention have been described.Nevertheless, it will be understood that various modifications may bemade without departing from the spirit and scope of the invention. Forexample, wafers used in the manufacture of MEMS disc drives may includecomponents for more than one disc drive. Accordingly, these and otherembodiments are within the scope of the following claims.

1. A device comprising: a housing; a rotatable media disc; and anactuator including a head to communicate with the rotatable media disc,wherein the housing, the rotatable media disc, the head and the actuatorare manufactured from a single wafer substrate.
 2. The device of claim1, further comprising an environmental control component, wherein theenvironmental control component is manufactured from the single wafersubstrate.
 3. The device of claim 2, wherein the environmental controlcomponent is integrated within the housing.
 4. The device of claim 2,wherein the environmental control component comprises a resistive wireto heat the device.
 5. The device of claim 2, wherein the environmentalcontrol component comprises a Peltier cooling system.
 6. The device ofclaim 1, further comprising actuator electrodes, wherein the actuatorelectrodes rotate the media disc within the data storage device.
 7. Thedevice of claim 1, wherein the media disc is a magnetic media disc. 8.The device of claim 1, wherein the housing comprises a substratesuitable for batch processing.
 9. The device of claim 8, wherein thesubstrate is a silicon substrate.
 10. The device of claim 1, furthercomprising a sensor integrated within the housing, wherein the sensor ismanufactured from the single wafer substrate.
 11. The device of claim10, wherein the sensor is an accelerometer.
 12. The device of claim 10,wherein the sensor is a thermometer.
 13. The device of claim 1, whereinthe housing, the rotatable media disc, the head and the actuator weremanufactured from a single wafer substrate using MEMS techniques. 14.The device of claim 1, wherein the device is a small form factor discdrive.
 15. The device of claim 1, wherein the device is a fullyintegrated device built entirely on the single wafer substrate.
 16. Thedevice of claim 1, wherein the actuator arm is part of an actuatorassembly, wherein the device further comprises a motion limiter toprevent the actuator assembly from contacting the rotatable media disc,wherein the motion limiter is located at a distance of less than 25micrometers from the actuator arm.
 17. A device comprising: a housingincluding a base and a cover; a MEMS rotatable media disc; and a MEMSactuator including a head to communicate with the rotatable media disc,wherein the MEMS actuator is bonded to the base or the cover.
 18. Thedevice of claim 17, wherein the cover is wafer bonded to the base. 19.The disc drive of claim 17, wherein the MEMS rotatable media disc andthe base combine to form an integrated disc/motor to rotate the MEMSrotatable media disc.
 20. The disc drive of claim 19, wherein MEMSrotatable media disc includes magnetizable components, wherein the baseincludes actuation electrodes that interact with the magnetizablecomponents to rotate the MEMS rotatable media disc.
 21. The disc driveof claim 17, further comprising an environmental control component. 22.A device comprising: a rotatable media disc; and a housing including abase, wherein the rotatable media disc and the base form an integrateddisc motor to rotate the rotatable media disc, wherein the base and therotatable media disc are manufactured as a single component from asingle wafer substrate.
 23. The device of claim 22, wherein the deviceis a small form factor disc drive.
 24. The device of claim 22, furthercomprising an environmental control component within the housing,wherein the environmental control component is manufactured from thesingle wafer substrate.
 25. The device of claim 22, further comprisingan accelerometer integrated within the housing, wherein theaccelerometer is manufactured from the single wafer substrate.
 26. Thedevice of claim 22, wherein the rotatable media disc includes a spin-onglass.